on the same board where surface mount soldering occurs, making it indispensable for high-density and high-frequency applications. Enhanced Shelf Life:
Explicitly covers requirements for mixed-technology boards where one finish must support soldering, gold wire bonding, and contact mating (e.g., edge connectors or steel dome contacts). Recent Revisions
) standard deviations from the process mean , typically evaluated on a reference test pad. ipc4556 pdf
Evaluates how well the finish wets with solder using wetting balance tests or edge dip tests.
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Suggested acceptance criteria example:
Providing reliable wetting for leaded and lead-free solders. on the same board where surface mount soldering
To ensure you are working with the most current, legitimate version (IPC-4556A), it is highly recommended to obtain the document directly from official sources:
Following this specification allows manufacturers to produce high-reliability boards suitable for advanced industries like aerospace, medical, and automotive. IPC 4556A - Accuris Standards Store Evaluates how well the finish wets with solder
Assemblies requiring both SMT soldering and wire bonding on the same board.