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Delivers localized, regulated voltage boosting within auxiliary computing slots. Typical Layout and Circuit Guidelines

When the SHDN pin is driven low, the IC isolates the load from the input source completely. In this shutdown state, the quiescent current draw drops to a fraction of a microamp, preserving battery longevity in portable electronics during idle states. Standard Application Circuits To safely step up power from a typical lithium-ion battery to a stable rail, the demands minimal external routing: Input Bypassing: Place a hxje ic datasheet top

activates normal operations. Do not leave this pin floating.

The is a widely utilized, highly efficient specialized power management component, primarily recognized as the top marking for the HX4004 / HX4004A and PS3120A series of inductorless lithium battery boost integrated circuits . Operating as a regulated charge pump DC/DC converter, this IC is house-packaged in a compact SOT23-6 surface-mount format . Hardware designers favor it for applications requiring step-up voltage regulation without bulky external inductors. Standard Application Circuits To safely step up power

Here’s a blog post based on the keyword . Since “HXJE” doesn’t appear to be a standard, widely documented IC (it may be a misprint, internal code, or very specific OEM part), I’ve structured the post to help engineers and hobbyists navigate similar ambiguous part numbers and find the right datasheet.

Automatically scales capabilities based on input voltage thresholds. 360 kHz (Constant Frequency) Operating as a regulated charge pump DC/DC converter,

Active-high Enable input. Driving this pin to ground forces the IC into a low-current shutdown mode; pulling it to VINcap V sub cap I cap N end-sub

Non-sensing boost / Voltage doubler that requires only external capacitors, making it an "inductorless" solution. Pinout Configuration (SOT-23-6)

2D and 3D X-ray systems can image the internal lead frame and bond wires without destroying the IC. This reveals whether the chip is a monolithic die, a multi-chip module, or simply a passive array.

F ceramic flying capacitor directly across Pins 4 and 6. Connect a from VINcap V sub cap I cap N end-sub to GND, and replicate a similar capacitor value on the VOUTcap V sub cap O cap U cap T end-sub pin to ground. Layout Best Practices